More compact, more reliable and more modular:
Innovations for embedded systems at electronica 2014
The global market for embedded systems is growing at a rate of up to eight 
percent. Market volume in Germany alone is currently more than EUR 20 billion. Application-oriented solutions and products for this market of the future will be on display at electronica 2014 (Fair ground) from November 11-14.
The embedded platforms conference (November 12-13, Hall plan), which is being held for the second time, sheds light on aspects of innovative hardware and software, from component selection to system design, and demonstrates how the industry can meet future challenges.
In many parts of the electronics industry, future-proof and reliable embedded systems are crucial for successful and sustainable product lines. The range of applications is extremely diverse: From telephony and automation to toys, customized solutions can now be found in every aspect of our lives. Visitors at electronica in Munich will find the perfect platform for a variety of requirements and products. Once again, the range of solutions at this year's fair is enormous. Besides highly efficient processor platforms, system architects and developers will learn all about the latest operating systems and networking technologies.
Efficient ecosystems at the
embedded platforms conference
To develop a successful electronic product, selecting the right embedded building blocks is not the only thing that matters. Interaction between the various components that is optimized for the respective application - i.e. the best hardware and software ecosystem - is also important. The embedded platforms conference is dedicated to these ecosystems. The conference, which is being held at the Messe München 
trade-fair center's Press Center East on November 12 and 13, also deals with basic issues that pertain to component selection and system design. Presentations by processor manufacturers and OS/RTOS companies such as IAR, Infineon MicroConsult, Silica and Texas Instruments will inform participants about the optimum selection of various tools, Open Source software, multicore migration and design challenges within ecosystems.
Visitors will get additional insights into this specialty area at the embedded Forum in Hall A6 (Hall plan). Presentations about "Smart Energy ", "ARM-based Microcontrollers ,FPGAs & SoCs", "Internet of Things" and a number of other topics will give them comprehensive information about components and practical applications.
Exhibitors present
solutions for future markets
MSC Technologies, a new division of Avnet Electronics Marketing EMEA, will be represented at electronica for the first time. "We focus on intelligent embedded and display solutions for various industrial applications - everything from a single source," says Wolfgang Eisenbarth, Director of Communications at MSC Technologies. In doing so, the company promises scalable processor technologies, advanced communications interfaces and maintenance-free system solutions, especially for future markets such as home automation and energy technology.
congatec is putting its money on growing requirements for high security standards: "Technologies must react to the industry's challenges," says Christian Eder, Marketing Director at congatec. "The embedded cloud is still growing, which could impact the necessary hardware. That also calls for particularly strong software support for reliable data transmission." Congatec will have certified hardware and software packages on display at electronica that meet these high requirements, even in continuous operation. One highlight will be conga-IGX, which the company is using to enter the industrial mini ITX market.
Future-oriented
embedded products for new industries
TDK will present the smallest Bluetooth smart module in the world: Thanks to its compact design and low height, the SESUB-PAN-T2541 Bluetooth 4.0 LE module is suitable for the future wearable devices market. It can also reduce the power consumption of battery-operated devices considerably. The company will also present a new series of ultra-small EPCOS µDC/DC converters. Measuring just 2.9 mm x 2.3 mm in size and with an insertion height of 1 mm, they can also reduce space requirements by an average of 35 percent.
Images: R. Eberhard, messekompakt.de, EBERHARD print & medien agentur gmbh
Source: Messe München
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